[2019] Seung Hwan Lee, Seunggun Yu, Faisal Shahzad, Jun pyo Hong, Seok Jin Noh, Woo Nyon Kim, Soon Man Hong, Chong Min Koo*, “Low percolation 3D Cu and Ag shell network composites for EMI shielding and thermal conduction”, Composites Science and Technology 2
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Seung Hwan Lee, Seunggun Yu, Faisal Shahzad, Jun pyo Hong, Seok Jin Noh, Woo Nyon Kim, Soon Man Hong, Chong Min Koo*, “Low percolation 3D Cu and Ag shell network composites for EMI shielding and thermal conduction”, Composites Science and Technology 2019, 182, 107778.
